| 摘要 |
PURPOSE: A production method of a laminated strip for a BGA semiconductor package and a device thereof is provided to be able to mass-produce by realizing an automatic operation of the production for strip, and to maintain the high reliability of products by minimizing of the defect rate. CONSTITUTION: The production device comprises: a frame supplying device(A) to supply a carrier frame(10) punched a square hole(11) to a heat compressor(C); an adhered tape supplying device(B) to supply a double-faced adhered tape(20) to the heat compressor(C); the heat compressor(C) to heat-compress the supplied carrier frame(10) and the double-faced adhered tape(20); an exfoliated paper removing device(D) to remove an exfoliated paper(22) from the heat-compressed double-faced adhered tape(20); a circuit substrate installing device(E) to install a film-typed circuit substrate(30) in the double-faced adhered tape(20) removed the exfoliated paper.
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