| 摘要 |
PURPOSE: A bonding device is provided to prevent static electricity from generating on a metal line, by supplying the air, ionized on a wire bonding device. CONSTITUTION: A wire bonding device comprise: a wire spool which a metal line is wounded; a hole which the metal line passes through; a wire tension section using the air to sustain a tightness; a wire clamp which the metal line passes, for maintaining the metal line; a bonding head for having a capillary which the metal line passed through the wire clamp passes, a capillary bonding the metal line to a semiconductor chip and an external element. The bonding device has an anion generator ionizing the air, supplied in the wire tension section. |
