PRODUCTION METHOD FOR CHIP SCALE PACKAGE

摘要

PURPOSE: A production method for a chip scale package is provided to improve the soldering between a solder ball and a substrate pad bonded on a solder ball pad. CONSTITUTION: The production method for a chip scale package comprises a step of: preparing a tape wiring substrate adhered an elastomer(50) having a certain thickness in one face of a polyimide tape(24); spreading a pre-flux(82) into a connection hole(23); forming a bean lead(60) by gilding a copper wiring(30) on a window(22); sticking a semiconductor chip into the elastomer; jointing the semiconductor chip and the beam lead; stitching the jointed part of the semiconductor chip and the beam lead; contacting a solder ball(68) into the copper wiring exposed in the connection hole.