METHOD OF FORMING ALIGNMENT MARK OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: The method improves the overlay accuracy by removing an oxide film causing CMP irregularity when forming an initial topology. CONSTITUTION: The method improves the alignment or the alignment measurement accuracy when forming a word line with a material including a metal or a metal component by using a topology as an alignment mark by forming the topology on an isolation region on a scribe line of a semiconductor substrate and forming an isolation insulation film and removing the isolation insulation film to reveal the topology with photolithography using a mask for scribe line.