| 摘要 |
PURPOSE: A multi chip package is provided to minimize the length and the height of a wire for connecting an inner lead with a bonding pad of a semiconductor chip and to improve the yield rate of the manufacturing process of the multi chip package. CONSTITUTION: The multi chip package comprises: a lead frame(210) having inner leads(214) and outer leads(216); a lower semiconductor chip(230') having an active surface attached by a double sided tape(254) on the lower area of the inner leads(214); and wires(226, 236') for electrically connecting bonding pads(222, 232') of the upper and the lower semiconductor chips(220, 230') corresponding to each inner lead(214), with each inner lead(214).
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