LEAD FRAME FOR TRANSISTOR PACKAGE

摘要

PURPOSE: A lead frame for a transistor package is provided to mount a semiconductor device into a precise location. CONSTITUTION: A lead frame for a transistor package comprises: a die pad(12) containing a transistor device and a controlling element on the upper surface; a heat sink(18) integrally formed with the die pad for containing a penetrating hole(19) for combining; and the heat sink connecting to an adjacent heat sink by a tie bar(13).