发明名称 WAFER TRANSFER APPARATUS
摘要 A semiconductor wafer transfer device includes a rotary member, a driving member which rotates coaxially with the rotary member, a driven member which is driven by the driving member and a frog leg linkage having a first link with an end fixed to the driving member, a second link with an end fixed to the driven member, a third link having an end pivotally joined to another end of the first link, and a fourth link having an end pivotally joined to the other end of the second link. A wafer support plate is supported on the other ends of the third and fourth links. An auxiliary escape mechanism is provided for moving the frog leg linkage out of its dead point. The mechanism includes a first pulley coaxillary fixed to the rotary member with the driving member, a second pulley rotatably supported on a pivot shaft pivotally joining the first and the third links, and a belt wound around the first and second pulleys. The radius of the first pulley is greater than the center distance between the driving member and the driven member. The diameter of the second pulley is smaller than that of the first pulley.
申请公布号 KR100240458(B1) 申请公布日期 2000.01.15
申请号 KR19920000006 申请日期 1992.01.03
申请人 SONY CORPORATION 发明人 TAKA, KEISHI
分类号 B25J9/00;B25J9/10;B65G49/07;H01L21/677;(IPC1-7):H01L21/68 主分类号 B25J9/00
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