发明名称 POLYSILICON THIN FILM FORMING METHOD
摘要 PURPOSE: A polysilicon thin film forming method is provided to reduce the time of process and the expenses. CONSTITUTION: A polysilicon thin film forming method comprises the steps of: forming a polysilicon thin film by chemical vapor deposition on the substrate; growing the grain size of the polysilicon thin film to a larger size; proceeding to a quick heat treatment at the temperature range of 600¯900°C with 50¯150°C/sec of rising temperature speed in an hour.
申请公布号 KR20000003458(A) 申请公布日期 2000.01.15
申请号 KR19980024700 申请日期 1998.06.29
申请人 HYUNDAI ELECTRONICS IND. CO., LTD. 发明人 KIM, WOO HYUN;KIM, CHANG YOUNG
分类号 H01L21/20;(IPC1-7):H01L21/20 主分类号 H01L21/20
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