发明名称 |
POLYSILICON THIN FILM FORMING METHOD |
摘要 |
PURPOSE: A polysilicon thin film forming method is provided to reduce the time of process and the expenses. CONSTITUTION: A polysilicon thin film forming method comprises the steps of: forming a polysilicon thin film by chemical vapor deposition on the substrate; growing the grain size of the polysilicon thin film to a larger size; proceeding to a quick heat treatment at the temperature range of 600¯900°C with 50¯150°C/sec of rising temperature speed in an hour.
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申请公布号 |
KR20000003458(A) |
申请公布日期 |
2000.01.15 |
申请号 |
KR19980024700 |
申请日期 |
1998.06.29 |
申请人 |
HYUNDAI ELECTRONICS IND. CO., LTD. |
发明人 |
KIM, WOO HYUN;KIM, CHANG YOUNG |
分类号 |
H01L21/20;(IPC1-7):H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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