WAFER RECYCLING METHOD FOR SEMICONDUCTOR DEVICE PRODUCTION

摘要

PURPOSE: A wafer recycling method for a semiconductor production is provided for an economic gain by recycling a specific pattern formed wafer for production. CONSTITUTION: The wafer recycling for a semiconductor device production is performed in the process of; grinding the face of a wafer film from the back of the wafer for production; rough polishing the back of the wafer for production from which a specific film is removed; polishing the face of the wafer for production; washing the wafer for production.