| 摘要 |
PURPOSE: A ball grid array package is provided to improve super-heat emission characteristic. CONSTITUTION: The ball grid array package comprises: a semiconductor chip(210) having plural bonding pads(212); a printed circuit board(230) having an upper part(234) on which electrode pads corresponding to the bonding pads are formed, a lower part(236) on which solder balls(260) are formed, and metal wires(238) to which the solder balls and the electrodes pads are electrically connected; a wire(240) for electrically connecting the bonding pad to the electrode pad; a sealing material(160) for sealing the semiconductor chip, the wire and the upper part of the printed circuit board, wherein the printed circuit board further comprises a radiation fin(270) having such an opening that its part corresponding to the semiconductor chip is removed, wherein the radiation fin is attached so as to bar the opening of the lower part; and wherein the semiconductor chip is inserted in the opening so as to be disposed on the radiation fin.
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