发明名称 |
METHOD FOR MANUFACTURING NONVOLATILE MEMORY DEVICES |
摘要 |
PURPOSE: A fabrication method of nonvolatile memory is provided to improve a reliability of gate oxide by reducing a recess generated at the surface of active region adjacent to an isolation layer. CONSTITUTION: The method comprises the steps of: forming an isolating oxide layer(61) defining an active region and a device isolation region on a semiconductor substrate(51) divided by memory cell array, high voltage device and low voltage device regions; sequentially depositing a first gate oxide(63) and a first conductive layer(65); forming an interlayer dielectric(67) and selectively etching the interlayer dielectric, the first conductive layer and the first gate oxide formed in the high voltage device region; forming a second gate oxide(71) and selectively etching the interlayer dielectric, the first conductive layer and the first gate oxide formed in the memory cell array and the low voltage device regions; depositing a third gate oxide(75) and a second conductive layer on the resultant structure; and forming a control gate(77) in the cell array region and forming gates(77',77") of the high voltage and low voltage devices in the high voltage and low voltage device regions, respectively.
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申请公布号 |
KR20000001033(A) |
申请公布日期 |
2000.01.15 |
申请号 |
KR19980021057 |
申请日期 |
1998.06.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KANG, JEONG OUI;SIN, WANG CHEOL |
分类号 |
H01L21/316;(IPC1-7):H01L21/316 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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