发明名称 METHOD FOR MANUFACTURING NONVOLATILE MEMORY DEVICES
摘要 PURPOSE: A fabrication method of nonvolatile memory is provided to improve a reliability of gate oxide by reducing a recess generated at the surface of active region adjacent to an isolation layer. CONSTITUTION: The method comprises the steps of: forming an isolating oxide layer(61) defining an active region and a device isolation region on a semiconductor substrate(51) divided by memory cell array, high voltage device and low voltage device regions; sequentially depositing a first gate oxide(63) and a first conductive layer(65); forming an interlayer dielectric(67) and selectively etching the interlayer dielectric, the first conductive layer and the first gate oxide formed in the high voltage device region; forming a second gate oxide(71) and selectively etching the interlayer dielectric, the first conductive layer and the first gate oxide formed in the memory cell array and the low voltage device regions; depositing a third gate oxide(75) and a second conductive layer on the resultant structure; and forming a control gate(77) in the cell array region and forming gates(77',77") of the high voltage and low voltage devices in the high voltage and low voltage device regions, respectively.
申请公布号 KR20000001033(A) 申请公布日期 2000.01.15
申请号 KR19980021057 申请日期 1998.06.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KANG, JEONG OUI;SIN, WANG CHEOL
分类号 H01L21/316;(IPC1-7):H01L21/316 主分类号 H01L21/316
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