| 摘要 |
PURPOSE: A stack-type semiconductor package is embodied by using a support assembly of a vertical structure as an out-frame of a body. CONSTITUTION: The semiconductor package comprises: a pair of semiconductor chips having a plurality of bonding pads sticked to front sides thereof, wherein back sides of the chips are attached to forward and backward sides of a substrate, respectively; a pair of support assemblies having a lower portion, by which both ends of the substrate are surrounded, and a lateral side perpendicular to the lower portion and connected thereof; a plurality of leads arranged between the substrate and the support assembly and extended up to the back side of the substrate through the substrate and the lower side of the support assembly, wherein a predetermined part of each lead is exposed outside the substrate and is extended up to the back side of the substrate; a plurality of wires electrically connected to the bonding pads of the semiconductor chips and the leads, respectively; and a capsule layer for covering the a semiconductor chip between the support assembly of the pair, the substrate, wires and the leads.
|
