CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

PURPOSE: A CMP(chemical mechanical polishing) apparatus is provided to improve a uniformity of polishing rate by using multi-carriers and a slurry supplying nozzle. CONSTITUTION: The CMP apparatus comprises: a plurality of carriers(102) for loading a wafer(104); a polishing pad(106) for polishing the wafer(104); and a slurry supplying nozzle(112) for supplying a slurry to the polishing pad(106). The slurry supplying nozzle(112) is formed at front surface of the carrier(102) and has a plurality of holes. The structure of the slurry supplying nozzle(112) is curve.