PURPOSE: A lead on chip package is provided to prevent a bending of the package and a cracking of wire heel by improving an inner lead structure of a lead frame. CONSTITUTION: The lead on chip package comprises: a semiconductor chip(10) formed on a plurality of center pads(11); a leadframe(20) having an inner lead(21) and an outer lead(23) formed in a bending to prevent bending and adhesive to the semiconductor chip(10) thereon; a bonding wire(40) electrically connected between the inner lead(21) and the center pads(11); and a molding resin(50) for molding the members in order to prevent from external environments.
