FORMING METHOD OF DEVICE SEPARATING FILM FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE: A forming method of a device separating film for a semiconductor element is provided to prevent the deterioration of an active area. CONSTITUTION: The forming method of the element separating film for the semiconductor element comprises a step of: forming a pattern of a photosensitive film(13) to expose a non-active area of a semiconductor substrate(11); forming an active area by etching a part of an exposed nitric film and the lower non-active areas; thick spreading a first flatted film onto the front face of the semiconductor substrate; removing a thickness of the first flatted film(14) to expose the upper part of the remained nitric film and the active areas.