<p>PURPOSE: A semiconductor package has the effects of reducing the weight and thickness of the package and simplifying the package by adopting a solder ball(7) as an external terminal and fabricating the package simply by using a web frame(13) of grid shape. CONSTITUTION: A semiconductor package comprises: a web frame(13) of grid shape attached on the bottom surface of a semiconductor chip(11) with a both-sided tape; many conduction terminals(14) installed in the crossing part of the web frame; metallic wires(15) connecting chip pads(11a) of the chip with the conduction terminals electrically; an encapsulation molded on the top surface of the web frame to wrap metallic wires; and solder balls(17) attached on the bottom surface of conduction terminals where metallic wire is connected among conduction wires installed with the web frame.</p>
