PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE: A production method for a semiconductor device is provided to prevent the reduction of a processing margin according to a shadowing effect by a photoresist when implanting for forming a well or a joining layer. CONSTITUTION: The production method for a semiconductor device comprises a step of: spreading a photoresist(23) onto a semiconductor substrate(20); forming a pattern of the photoresist by patterning the photoresist, and being at least one size of the open area of the pattern of the photoresist larger than the size of the prearranged implanted area; forming the implanted area by operating an inclined implantation using the pattern of the photoresist as the implanted mask.