SEMICONDUCTOR MICROMACHINING METHOD

摘要

A method of micromachining a silicon wafer that simultaneously forms narrow gaps having a width of 10 mu m or less and wider gap portions using an anistropic etching solution. The etching solution contains KOH in a concentration of 35% or less and the penetration etching is carried out such that the etching of the opposing walls and the face of the silicon wafer occur at the same rate. A method of manufacturing a capacitance-type acceleration detector in a silicon wafer using the aforementioned etching method.