| 摘要 |
PURPOSE: A semiconductor lead-frame unloading system is provided to reduce unloading time by successively supplying lead frames and by unloading lead frames of various standards. CONSTITUTION: The semiconductor lead-frame unloading system for loading a lead frame on a magazine comprises: a picker(5) for picking up the lead frame to transfer the picked lead frame; a guide path(6) for passing the lead frame transferred by the picker(5), wherein the guide path has adjustable width and length; a buffer apparatus(7) for loading the lead frame passed through the guide path during a predetermined time; a lead-frame elevating apparatus(8) for piling up the lead frame transferred from the buffer apparatus on the magazine; and a magazine transferring apparatus(9) for sequentially transferring a next magazine to the guide path.
|
