ELECTRONIC PART MOUNTING BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

An electronic part mounting board (1) is provided comprising a substrate (10) having an electronic part mounting opening (13) formed in an upper surface thereof and a recess provided on a rear surface thereof and larger in size than the electronic part mounting opening; a heat radiating plate (2) fixed to the recess by means of a bond (3) with a position of an upper surface of the heat radiating plate (2) exposed to the electronic part mounting opening (13); an exposed depression (4) extending over the substrate and the heat radiating plate (2) at a position where a side wall (12) of the recess and a side wall (21) of the heat radiating plate (2) confront each other and having a part of the bond exposed flush with the bottom surface thereof; and a metal plating layer (75) continuously covering in sequence a lower surface of the heat radiating plate (2), a surface of the exposed depression (4) and a rear surface of the substrate (10). Furthermore a method of manufacturing the aforesaid electronic part mounting board is provided.