| 摘要 |
PURPOSE: A chemical mechanical polishing machine is provided to improve a polishing uniformity of a wafer by forming a predetermined groove, passing through a retainer ring and formed at a surface of the retainer ring, so as to effectively supply a slurry. CONSTITUTION: The chemical mechanical polishing machine comprises a polishing head(2) which is comprised of a wafer chuck(22) for supporting a wafer at a chemical mechanical polishing process; a retainer ring(36) surrounding the chuck, for preventing a separation of the wafer when the wafer is polished; a polishing housing(28) for forcing a polishing pressure and for supporting the chuck and the retainer ring, wherein a plurality of grooves are formed at a surface of the retainer ring, the respective grooves having predetermined width and depth, spaced from each other and passing through the retainer ring.
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