| 摘要 |
PROBLEM TO BE SOLVED: To provide multi-layer wiring board wherein no disconnection, etc., takes place with a thin-film wiring conductor layer and a through hole conductor by raising the joint strength between the thin-film wiring conductor layer and through hole conductor and an organic resin insulating layer, especially that between such thin-film wiring conductor layer and through hole conductor as with very thin wire thickness and an organic resin insulating layer. SOLUTION: Related to a multi-layer wiring board wherein a substrate 1 is electrically connected to a thin-film wiring conductor layer 3 wherein, formed on the substrate 1, an organic resin insulating layer 2 and a thin-film wiring conductor layer 3 are alternately laminated while positioned above and below through a through hole conductor 6 coated on the inside wall of a through hole 5 provided at the organic resin insulating layer 2, the thin-film wiring conductor layer 3 and the through hole conductor 6 are formed of first layers 3a and 6a of the metal comprising organic resin particles and of second layers 3b and 6b of such metal as well jointed to the metal of the first layers 3a and 6a. |
