| 摘要 |
PROBLEM TO BE SOLVED: To prevent crackings, chippings, etc., of a ceramic substrate, when the substrate is positioned by chamfering the corner sections of the substrate respectively formed of the broad upper and lower surfaces and narrow side faces of the substrate. SOLUTION: A planar ceramic substrate 1 has a broad upper surface 3 on which splitting grooves 2 are formed, a broad lower surface 4, narrow side faces 5 and 6, and corner sections 7 and 8 respectively formed of the upper and lower surfaces 3 and 4 and side faces 5 and 6. The corner sections 7 and 8 are chamfered to have smooth circular-arcuate R faces, linear C faces, etc. The R and C faces are formed, by pressing the corner sections to a die, when a ceramic green sheet is cut into a prescribed outside dimension with the die. The chamfering sizes of the corner sections are set 1/2 or smaller than the thickness of the substrate 1, but 0.01 mm or larger. The chamfered ceramic substrate can be positioned accurately, when the substrate is used as a hybrid IC board, a substrate for mounting electronic parts, etc., because the used positioning mechanism can operate smoothly.
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