| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming bump electrodes required at the time of mounting a semiconductor chip on a circuit board by facedown mounting, in which the bump electrodes can be formed accurately on an electrode pattern formed on the circuit board without requiring a highly accurate mask or a process hard to implement even in the case of fine pitch. SOLUTION: This method comprises a step of forming a plating resist layer 3 on the entire semiconductor mounting face of a circuit board 1 where a circuit pattern 2 is formed, a first plating resist removing step for removing the plating resist layer 3 on the circuit pattern 2 which is bonded to a semiconductor element by means of laser, a step for applying electrolytic plating of same thickness as the plating resist layer 3 or less, and a second plating resist removing step for removing all of the plating resist layer 3.
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