| 摘要 |
PROBLEM TO BE SOLVED: To mold a leaf-like package panel constituting a plurality of semiconductor packages in a state of being not adversely affected on a wire owing to a wire sweep, an inclination, etc., without causing an unfilled position of a resin. SOLUTION: In a molding die 20 for resin-sealing in a series over the entire face on a main face of an insulation frame 11 on which a plurality of semiconductor elements 12 are mounted, a gate 31 of which a length is at the substantially equal length to a long side part of a cavity 23 is provided. A melting resin 26 composed of a thermosetting resin of long gel type is supplied from a pot 27 provided in a part of the molding die for this gate via a cull 29 and a runner 30, so that the melted resin is uniformly filled over the entire face from the long side part of the cavity via the gate 31. |
