| 摘要 |
PROBLEM TO BE SOLVED: To surely mount a solder ball to the pad of a substrate without using electrostatic power that is difficult to be controlled in a solder ball-mounting device. SOLUTION: A mechanism for eliminating static electricity is provided, thus also eliminating fine charges which are electrified naturally before retaining of a solder ball 13, and surely retaining a required number of the solder balls 13. Then, the solder ball 13 vacuum chucked is brought closer to the surface of flux 18 of a pad 17, so that the solder ball 13 can touch the surface of the flux 18, the solder ball 13 is pressed against the pad 17 while the solder ball 13 is being vacuum chucked, and the solder ball 13 is made to be embedded into the flux 18 with an adhesive force for retaining.
|
