| 摘要 |
PROBLEM TO BE SOLVED: To obtain a manufacturing method of electronic component, in which a cap member can be carried using a small and inexpensive carrier at bonding of the cap member to a case substrate and the can member cart be bonded efficiently to the case substrate, without increasing fluctuations in the coating of adhesive. SOLUTION: A cap member is carried from a part feeding section 3 onto a bonding stage 4, having upper surface applied with an adhesive layer 4a by means of a first carrying member 7b. The cap member is mounted on the adhesive layer 4a and applied with adhesive, and then it is carried onto a case substrate 5 using a second carrying member 8c. Finally, the cap member is bonded to the case substrate 5. |
