发明名称 METHOD AND DEVICE FOR CUTTING PSEUDO CONDUCTIVE PART AND COMBINEDLY REMOVING DISTORTION IN PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To inexpensively and securely cut a pseudo conduction part and to surely remove a defective article by sandwiching a printed board with heating plates whose surfaces are heated to a specified temperature and sandwiching it with cooling plates into which coolant is provided inside. SOLUTION: A heating plate 3 on an upstream side and a heating plate 4 on a down stream side are heated to 200 deg.C, 220 deg.C, for example. On the other hand, a cooling plate 5 on the upstream side is set to 100 deg.C, and a cooling plate 6 on the down stream side to 40 deg.C. When transportation blades 33 are stored in slits 15, 16, 19 and 20, upper plates 3b-6b are abutted on lower plates 3a-6a, and the surface/back of a printed board are simultaneously heated or cooled through a silicone rubber. Since the printed board is heated and cooled by sandwiching it by two upper/lower plates and by making the temperatures of the upper/lower plats to be equal, a pseudo conduction part owing to a heat difference can be cut and the warp and the bent of the printed board are corrected.
申请公布号 JP2000013002(A) 申请公布日期 2000.01.14
申请号 JP19980192477 申请日期 1998.06.22
申请人 FUJI MACHINERY KK 发明人 FUJITA MITSUYUKI
分类号 H05K3/22;(IPC1-7):H05K3/22 主分类号 H05K3/22
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