| 摘要 |
PROBLEM TO BE SOLVED: To facilitate the formation of a projection working section for electrical contact and a fine circuit wiring section on the same laminated circuit board forming member by making the thickness of a conductor layer in at least the projection working section for electric contact thicker than that of conductor layer in a wiring pattern forming section. SOLUTION: On the same circuit board forming member, in which a conductor layer 3 is laminated upon an insulating layer 1 with an adhesive 2, an unbreakable projection for electrical contact is formed by making the thickness of the conductor layer 3 in a projection working sections 3-3 thicker than that of the layer 3 in the other section, and a fine wiring circuit is formed by making the thickness of the layer 3 in a wiring pattern forming section 3-2 thinner. The variable-thickness conductor layer 3 is formed by forming the wiring pattern forming section 3-2 through mechanical polishing, chemical polishing, or rolling. Since at least the projection working section 3-3, electrical connecting terminal which forms section 3-1 and wiring pattern forming section 3-2 of the conductor layer 3 can be molded integrally when such a forming method is used, the electrical continuity characteristic of the conductor layer 3 can be improved.
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