| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave device which does not need external parts at the time of connecting an inductance and whose performance is improved without considerably raising the resistance value of a wiring. SOLUTION: Relating to a surface acoustic wave device, terminals are formed at the side and the back of a package 1 and bonding pad parts 3a, 3b, 3c, 3d, 3e and 3f are given in accordance with the terminals. A bonding pad part 15 which is not connected to any terminal and a bonding pad part 18 which is not electrically connected to others are provided. The bonding pad parts 7 and 3e of a surface acoustic wave element 5 are wire-bonded by a wire 11, bonding pad parts 17 and 15 by a wire 19a, bonding pad parts 15 and 18 by a wire 19b and bonding pad parts 18 and 3b by a wire 19c. Then, they are electrically connected. The wires 19a, 19b and 19c are connected in series and a function as an inductor is given.
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