| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device where there is no fear of damaging a sealing resin member filled in the gap between a semiconductor chip and a circuit board due to fatigue by heat cycles, and also which is high in space efficiency. SOLUTION: This device 21 is one being made by flip-chip connecting a circuit board 23 and a semiconductor chip 22, and also filling a sealing resin member 28 in the gap 27 between the circuit board 23 and the semiconductor chip 22, and hardening it. Here, the circuit board 23 is made in the same square shape as the semiconductor chip 22, and further at least one ridge of the circuit board 23 facing the gap 27 is chamfered for forming a dispense face 26, and dispense space 37 is provided in the section of the gap 27, and a sealing resin member 28 is sent out to this dispense space 37 while shifting it in the direction of the ridge from a dispense device, and it is filled in the gap 27 at large by capillary phenomena in such a way as to collect the sealing member 2 herein once.</p> |
