| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a compound material for the substrate of a semiconductor device that maintains high heat conduction and low thermal expansion characteristics, and prevents deformation, damage, and deterioration of thermal characteristics due to thermal history. SOLUTION: In a compound material 3, a fiber 1 made of carbon and/or graphite fiber where a fiber length is set to 1,000μor less and an aspect ratio is set to 100 or less is randomly aligned in a two-dimensional direction with a volume fill rate of 20-60% in a metal matrix 2, where molybdenum, tungsten, or their mixture is added to copper or copper alloy with a volume rate of 15-50% for the metal matrix.</p> |
