| 摘要 |
<p>PROBLEM TO BE SOLVED: To suppress chemical contamination on a semiconductor wafer by storing the semiconductor wafer in the volatile gaseous phase of a volatile organic solvent whose adhesion probability is equal to or less than specified. SOLUTION: A semiconductor wafer is washed with a chemical liquid, is rinsed with ultra-pure water, and is dried. Immediately after this, the semiconductor wafer is retained in a gas atmosphere containing a volatile organic solvent with an adhesion probability of 1/1,000 or less. In this manner, by allowing a large amount of volatile organic solvent with an adhesion probability of 1,000 or less to exist other than an organic matter with a high adhesion probability, the volatile organic solvent with an adhesion probability of 1/1,000 or less frequently repeats adhesion and elimination and an organic matter with a high adhesion probability adheres to an adsorption site with less probability in the adsorption site on the wafer surface. Also, immediately after the wafer is taken out of a storage container, the volatile organic solvent existing in the attraction site is discharged into air and the wafer surface becomes clean.</p> |
