| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated semiconductor device heat dissipating structure, which is capable of enhancing a semiconductor chip in heat dissipating effect and capable of making it operate stably. SOLUTION: A laminated semiconductor device heat dissipating structure has a structure, in which modules composed of semiconductor chips 1a and 1b mounted on module boards 2a and 2b respectively in a flip chip mounting manner are laminated in two or more layers for the formation of a two or more layered semiconductor device, and the semiconductor device is mounted on a motherboard 4, wherein heat dissipating vias 5 are provided to the module boards 2a and 2b and the motherboard 4 penetrating through them in the thickness direction so as to come to into contact with the semiconductor chips 1a and 1b or a thermally conductive plate 6.
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