| 摘要 |
PROBLEM TO BE SOLVED: To prevent a defective capacitor from occurring due to an electrical discharge that occurs through a dielectric film. SOLUTION: An upper electrode 114 is formed above a semiconductor board 104, a wiring 14 electrically connected to the lower electrode of a capacitor 108 is formed, and a first and a second pad 16 and 18 connected to the wiring 14 at different points are formed. Thereafter, a wafer test is carried out in a final manufacturing process, where wafer probes are put on the first and second pad 16 and 18 to be energized apply a voltage between them, whereby the wiring 14 is fused. Therefore, even if the capacitor 108 is charged up in a manufacturing process, electric charge is discharged from the capacitor 108 through the wiring 14 at once, so that a defective capacitor which occurs due to an electric discharge that takes place through a dielectric film included in the capacitor 108 can be avoided, and a manufacturing yield can be restrained from decreasing.
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