| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-layer substrate wherein smear-removal is performed under an appropriate condition after inner via hole work. SOLUTION: Related to a method for manufacturing a multi-layer substrate, an inner via hole 4 is formed at an insulating resin layer 3 across a circuit pattern 2 by laser working for the circuit pattern 2 of each layer to be conductive, and after a smear 3a on the surface of the circuit pattern 2 at the bottom surface of the inner via hole 4 is removed by plasma process, the inner via hole 4 is irradiated with ultraviolet light, and the fluorescence emitted from the smear 3a is detected by a fluorescence detecting sensor 24 to inspect the residue state of the smear 3a. Thus, an appropriate process condition for removing smear is set for appropriate smear removal. |
