| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of connection and yield when making a semiconductor by laminating a plurality of bare chips. SOLUTION: A long wiring containing insulation film 4 comprises, for example, five consecutive unit films in the one dimensional direction, each of which is for one bare chip. The insulation film 4 is folded alternatively by about 180 degrees for every unit films 5 and the bare chips 2 are mounted on every unit films 5. A plurality of bare chips 2 is laminated in the depth direction as a whole. Then, all the bare chips 2 are wrapped by fixing the end of the wiring containing insulation film with the lowest bare chip 2 to form a semiconductor device 1.
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