| 摘要 |
PROBLEM TO BE SOLVED: To adapt to a center pad type semiconductor chip, having high deign flexibility by comprising a semiconductor package substrate provided with a lead bar, a semiconductor chip forming a pad, and an upper cover with which the semiconductor chip including a conductive wire and pad is coated. SOLUTION: This semiconductor package substrate 100 comprises an insulator 30 and a lead bar 31 and has a sectional configuration forming a through-hole by opening. The lead bar 31 comprising a horizontal lead 31a and a vertical lead 31b is formed. A semiconductor chip 33 is adhered to the horizontal lead 31a via insulation adhesives 32, to form a pad 33a. The pad 33a is connected to the horizontal lead 31a by a conductive wire 35. An upper cover 36, with which the semiconductor chip 33 is coated including the conductive wire 35, and the pad 33a is provided. As a result, it is possible to prevent the occurrence of signal delay and prevent the sagging and the like of the wire. |
