| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing equipment having nozzles and a spin chuck, which prevents a chemical solution from rebounding on a wafer. SOLUTION: A semiconductor device manufacturing equipment has a spin chuck 42 that turns with a wafer W, placed thereon and to be loaded in a chamber 46, and a plurality of nozzles 44 for ejecting a chemical solution 43 for manufacturing semiconductor devices on this wafer W. The semiconductor device manufacturing equipment has poles 48 surrounding the outer frame of the wafer W and placed inside the chamber 46, in such a way as to be able to shield the chemical liquid 43 discharged on the wafer W and scattering toward the inner wall of the chamber 46 by the centrifugal force. The semiconductor device manufacturing equipment further has a cover 50, which is set apart from the top surface of the wafer W on the spin chuck 42 at a predetermined distance maintained and which has a plurality of holes formed at the locations of the nozzles 44 that are put through the holes. The cover 50 is attached to be movable vertically to the chamber 46 and the upper end portions of the poles 48. |
