| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for performing the sealing formation of a semiconductor that can prevent the bending failures of a wire from occurring. SOLUTION: A semiconductor device is manufactured by sealing a semiconductor element 1 and a wire 3 for connection with a thermoplastic resin composition. The thermoplastic resin composition containing a PPS resin and an inorganic filler is used, the surrounding of a wire 3 is sealed by a thermoplastic resin composition with a low melting viscosity containing 80-99 wt.% PPS resin, and then the outside is sealed by the thermoplastic resin composition that has a melting viscosity higher than the resin composition and contains 30-70 wt.% PPS resin. The surrounding of the wire 3 can be sealed with the thermoplastic resin composition with a high content of PPS resin, a low melting viscosity, and satisfactory flow behavior, thus preventing a sweeping phenomenon for pushing the wire 3 to flow from occurring easily.</p> |
