METHOD FOR INSPECTING VIA HOLE IN PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for inspecting a via hole of a printed wiring board that can securely judge the presence or absence of the remainder of an insulation covering and can suppress the occurrence of a faulty part by eliminating the connection failure of the via hole. SOLUTION: In a method for inspecting a via hole 3 of a printed-wiring board 1, the printed-wiring board 1 is manufactured with a method having a process for exposing the surface of a lower-layer conductor 4 by eliminating an insulation layer 2 on the lower-layer conductor 4 for allowing the lower-layer conductor 4 and the upper-layer conductor to conduct electricity by the via hole 3 via the insulation layer 2 of the printed-wiring board 1. In this case, a surface treatment layer 6 is provided on the surface of the lower-layer conductor 4 and at the same time up to the surface treatment layer 6 is eliminated in an insulation layer elimination treatment for forming the via hole 3, thus judging the remainder of the insulation cover 7 according to the state of the surface layer of the lower-layer conductor 4.