| 摘要 |
PROBLEM TO BE SOLVED: To prevent a defective package, even if a resin-encapsulated package is reduced in size and thickness by injecting resin from a plurality of resin injecting ports made in symmetrical positions with respect to the center of the plane of a cavity, in a resin encapsulating mold of a semiconductor device for encapsulating the semiconductor device. SOLUTION: A semiconductor chip 6 is set nearly at the center of a plane of a cavity 1a of a resin encapsulating die 1. Two resin pouring ports 2 are made in the resin encapsulating die 1, symmetric with respect to the center of the plane of the cavity. Resin 4 is poured through the resin injecting ports 2 from a pot portion 3 at the same time at the same injecting speed. The resin 4 can be injected equally from both sides of the cavity 1a, whereby the cavity 1a can be filled uniformly with the resin 4. Therefore, a die pad 5 and the semiconductor chip 6 can be resin encapsulated in a specified normal position as it is,. |
