| 摘要 |
PROBLEM TO BE SOLVED: To obtain sure electromagnetic shielding effect by reliably and electrically connecting a semiconductor element to a wiring conductor, reducing a space for electrically connecting them, and regulating the spread of a sealing resin. SOLUTION: A semiconductor element 1 where a metal heat sink 4 is allowed to adhere to a rear surface is fitted to nearly the central part of an outer enclosure with one surface is open in a nearly box type, the outside is covered with a conductive part 7, and the outer enclosure consists of resin moldings 7 and 8 with a plurality of wiring conductors 6. In the semiconductor element 1, its salient electrode 2 is jointed to an electrode part 6a which provided at each end of the wiring conductors 6, and each of the other end of the wiring conductors 6 is led to an area near the end part of the outer enclosure for constituting a connector pin. A sealing resin 5 is filled around the semiconductor element 1, and a partition wall 8a for preventing the sealing resin from flowing to the part of a connector 9 is provided. |
