| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size, thickness and cost of a liquid crystal panel module by chip-on-glass(COG) connection of a liquid crystal driver IC chip to the flanks of glass substrates constituting the liquid crystal panel. SOLUTION: The liquid crystal driver IC chip outputted by a driving signal to the liquid crystal panel 11 is COG-connected to the flanks of the glass substrates 12 and 13 constituting the liquid crystal panel. The upper glass substrate 12 and the lower glass substrate 13 are formed with conductive patterns on their flanks. At this time, the flanks are preferably subjected to an edging treatment in order to prevent a connection defect. Liquid crystal driving signal output terminals are formed in the lower portions of the liquid crystal driver IC chip 14. The respective liquid crystal driving signal output terminals and respective conductive patterns are connected by the COG-connection. The liquid crystal driving signal outputted from the liquid crystal driver IC chip 14 is transmitted to the liquid crystal panel 11.
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