发明名称 CONTACT STRUCTURE OF CONTACT WITH RESPECT TO SPHERICAL BUMP
摘要 <p>PROBLEM TO BE SOLVED: To provide an appropriate pressure contact with respect to both a spherical bump having a bigger diameter and a spherical bump having a smaller diameter by enhancing the reliability of a contact by a projection, when the projection of the contact comes into pressure contact with a side surface of the spherical bump. SOLUTION: In a contact structure of a spherical bump 2, in which first and second contact pieces 4, 5 are pressure-contacted with side surfaces facing to the spherical bump 2, the first contact pieces 4 has a first projection 6 pressure-contact with one side surface of the bump 2 on a meridian passing through one end of a diametrical line of the spherical bump 2, the second contact piece 5 has second and third projections 7, 8 brought into pressure-contact with the other side surface of the bump on both side of the meridian passing through the other end of the diametrical line of the spherical bump 2 and disposed at a spaced positions.</p>
申请公布号 JP2000009752(A) 申请公布日期 2000.01.14
申请号 JP19980181080 申请日期 1998.06.26
申请人 YAMAICHI ELECTRONICS CO LTD 发明人 ABE SHUNJI;KAWAMURA NOBUO;NAKAOKA TOMONORI
分类号 G01R31/26;G01R1/067;G01R1/073;H01L21/60;H01L21/66;H01L23/12;(IPC1-7):G01R1/073 主分类号 G01R31/26
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