| 摘要 |
PROBLEM TO BE SOLVED: To enhance heat dissipating efficiency through heat conduction. SOLUTION: In SOP-IC 29 provided with a chip-mounted tab 16, plurality of inner leads each of which is connected by a wire to the pad of a chip connected to each outer lead 19, and a resin sealed body 25 formed by resin sealing the chip, the tab and each inner lead, the tab 16 is exposed to the lower surface of the resin sealed body 25, through-holes 26 are formed on the resin sealed body 25, the lead pieces 29b formed on a tab suspension lead 15 is protruded into the through-holes 26, and they matched with the exposed surface of the tab 16. |
