| 摘要 |
PROBLEM TO BE SOLVED: To prevent stress by means of heat and the like from being added to a piezoelectric oscillation element even in a piezoelectric device adopting the supporting structure of a following type by fixing the piezoelectric oscillation element through a flexible printed board at the time of fixing it on a supporting face in a package. SOLUTION: A piezoelectric device 21 has constitution where it supports a piezoelectric oscillation element 25 in a two parts holding state on the flat upper face 23 of a base 22 through a flexible printed board 24 and the upper part of the base 22 is closely sealed by a metallic cover 26. The piezoelectric device 21 has structure where the flexible printed board 24 is previously laid on the inner base of a package formed of the base 22 and the metallic cover 26 and the lead pattern of a piezoelectric oscillation element 25 is connected on a wiring pattern positioned on the flexible printed board 24. The flexible printed board 24 is a film wiring board having flexibility and the wiring pattern formed of a conduction material is fixed and formed on it.
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