| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a semiconductor wafer and respective members of the positioning device from wearing out, and to prevent ground powder from being produced owing to the contact between the semiconductor wafer and the respective members of the positioning device. SOLUTION: This device is provided with a feed roller 4 which rotates the semiconductor wafer in a specific direction, by coming into contact with the peripheral surface of the semiconductor wafer 1 which has a V-shaped positioning cut 2 formed at the peripheral edge; a positioning roller 12 which is positioned at a distance from the feed roller 4 in the circumferential direction of the semiconductor wafer 1, and positioned in the cut of the semiconductor wafer 1 when the cut of the semiconductor wafer 1 rotated by the feed roller 4 is positioned opposite; and a receiving plate 10 where the semiconductor wafer 1 is mounted when the positioning roller 12 is positioned in the cut. When the positioning roller 12 is positioned in the cut and the semiconductor wafer 1 is mounted on the receiving plate 10, the feed roller 4 is released from being in contact with the peripheral surface of the semiconductor wafer 1.</p> |
