发明名称 THERMOCOMPRESSION BONDING DEVICE FOR WORK
摘要 PROBLEM TO BE SOLVED: To provide a thermocompression bonding device for work which is excellent in responsivity at heating/cooling, with shorter cycle time while cooling is allowed even at vacuum-sucking for excellent heat-insulation effect. SOLUTION: A ceramics heater 13 is attached to a rising/falling block 7 through a porous member 12 with gas permeability, and a thermocompression bonding tool 14 is attached to the ceramics heater 13. A sucking hole 18 of the thermocompression bonding tool 14 communicates with a vacuum-sucking part 22 through a pipe member 16 in a hole part 12a formed by penetrating the porous member 12. The porous member 12 is connected to an air supply source 23 and a nitrogen gas supply source 24 thus, a heat-insulating material which is needed so far is eliminated to improve the responsivity at heating/ cooling for shorter cycle time while the vacuum-sucking of a work and adiabatic cooling of a holding member are performed at the same time.
申请公布号 JP2000013005(A) 申请公布日期 2000.01.14
申请号 JP19980180102 申请日期 1998.06.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SATO SEIICHI
分类号 H05K3/32;H01L21/60;H05K3/34;(IPC1-7):H05K3/32 主分类号 H05K3/32
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