| 摘要 |
PROBLEM TO BE SOLVED: To improve the high frequency characteristic by reducing the inductance of a path between the connecting terminals of two boards, and to prevent a board from being affected by the mounting and demounting of the other board. SOLUTION: A plurality of springs 2a comprising a pressure contact portion and a retaining portion are held in an insulator 1a comprising a board inserting portion 11a in a state that the pressure contact portion is mounted on the deepest part of the board inserting potion 11a, and simultaneously a plurality of springs 2b are held by an insulator 1b connected to the insulator 1a in a state that a plurality of springs 2b are close to the deepest part of the board inserting portion 11a, 11b. One surface comprises a plurality of first pads connected to a plurality of corresponding connecting terminals 101a of a circuit board 100a by being pressed from the other surface by a plurality of springs 2a, further a plurality of second pads are connected to a plurality of corresponding first pads, and a trunk FPC(flexible printed circuit) film 3 is held on the board inserting portions 11a, 11b. |
